42-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS

Part	Material Flammability Rating	Termination Post Length	Current Rating	Row Spacing	Type	Mounting Type	Contact Material - Mating	Contact Finish - Post	Features	Housing Material	Pitch - Post	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Pitch - Mating	Contact Finish - Mating
Aries Electronics 42-3554-18	UL94 V-0	0.11 in	1 A	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Beryllium Nickel	Nickel Boron	Closed Frame	Glass Filled PEEK Polyetheretherketone	0.1 in	250 °C	-55 °C	Solder	42	21	2	Beryllium Nickel	50 µin	50 µin	0.1 in	Boron Nickel
Aries Electronics 42-3554-16	UL94 V-0	0.11 in	1 A	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Beryllium Copper	Nickel Boron	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	0.1 in			Solder	42	21	2	Beryllium Copper	50 µin	50 µin	0.1 in	Boron Nickel
Aries Electronics 42-3554-11	UL94 V-0	0.11 in	1 A	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Beryllium Copper	Gold	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	0.1 in			Solder	42	21	2	Beryllium Copper			0.1 in	Gold
Aries Electronics 42-3554-10	UL94 V-0	0.11 in	1 A	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Beryllium Copper	Tin	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	0.1 in			Solder	42	21	2	Beryllium Copper	200 Ąin	200 µin	0.1 in	Tin