CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Current Rating (Amps) | Mounting Type | Contact Finish - Mating | Termination Post Length | Termination Post Length | Type | Type | Type | Housing Material | Termination | Material Flammability Rating | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Features | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3554-11 | 1 A | Through Hole | Gold | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | Solder | UL94 V-0 | Beryllium Copper | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Gold | 48 | ||||||
Aries Electronics 48-3554-16 | 1 A | Through Hole | Nickel Boron | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | Solder | UL94 V-0 | Beryllium Copper | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Nickel Boron | 48 | 1.27 µm | 50 µin | 1.27 µm | 50 µin | ||
Aries Electronics 48-3554-18 | 1 A | Through Hole | Nickel Boron | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Polyetheretherketone (PEEK), Glass Filled | Solder | UL94 V-0 | Beryllium Nickel | 2.54 mm | 0.1 in | Beryllium Nickel | Closed Frame | 0.1 in | 2.54 mm | Nickel Boron | 48 | 1.27 µm | 50 µin | 1.27 µm | 50 µin | -55 °C | 250 °C |
Aries Electronics 48-3554-10 | 1 A | Through Hole | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | Solder | UL94 V-0 | Beryllium Copper | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Tin | 48 | 5.08 µm | 200 µin | 5.08 µm | 200 µin |