48-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Material Flammability Rating	Current Rating	Termination Post Length	Termination	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Material - Mating	Features	Contact Finish - Mating	Mounting Type	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Pitch - Post	Contact Finish Thickness - Mating	Row Spacing	Type	Contact Material - Post	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 48-3554-10	UL94 V-0	1 A	0.11 in	Solder	48	24	2	Beryllium Copper	Closed Frame	Tin	Through Hole	Tin	Glass Filled Polyphenylene Sulfide PPS	200 µin	0.1 in	200 Ąin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in
Aries Electronics 48-3554-16	UL94 V-0	1 A	0.11 in	Solder	48	24	2	Beryllium Copper	Closed Frame	Boron Nickel	Through Hole	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	50 µin	0.1 in	50 µin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in
Aries Electronics 48-3554-18	UL94 V-0	1 A	0.11 in	Solder	48	24	2	Beryllium Nickel	Closed Frame	Boron Nickel	Through Hole	Nickel Boron	Glass Filled PEEK Polyetheretherketone	50 µin	0.1 in	50 µin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Nickel	0.1 in	250 °C	-55 °C
Aries Electronics 48-3554-11	UL94 V-0	1 A	0.11 in	Solder	48	24	2	Beryllium Copper	Closed Frame	Gold	Through Hole	Gold	Glass Filled Polyphenylene Sulfide PPS		0.1 in		0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in