48-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Material - Mating	Type	Type	Type	Housing Material	Termination Post Length	Termination Post Length	Features	Number of Positions or Pins (Grid)	Mounting Type	Material Flammability Rating	Termination	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3554-10	Tin	5.08 µm	200 µin	1 A	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Copper	200 µin	5.08 µm	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 48-3554-16	Nickel Boron	1.27 µm	50 µin	1 A	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Copper	50 µin	1.27 µm	0.1 in	2.54 mm	2.54 mm	0.1 in	Nickel Boron
Aries Electronics 48-3554-18	Nickel Boron	1.27 µm	50 µin	1 A	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyetheretherketone (PEEK) Glass Filled	0.11 in	2.78 mm	Closed Frame	48	Through Hole	UL94 V-0	Solder	Beryllium Nickel	50 µin	1.27 µm	0.1 in	2.54 mm	2.54 mm	0.1 in	Nickel Boron	-55 °C	250 °C