Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Termination | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Contact Material - Mating | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Material - Post | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | 1 A | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | 10 çin | 0.25 çm | Gold | Gold | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | 24 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame |
Aries Electronics | Solder | 1 A | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | 200 µin | 5.08 µm | Tin | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 24 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame |