CONN IC DIP SOCKET 18POS GOLD
| Part | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Features | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish - Mating | Termination | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.5 in | 12.7 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Open Frame | Gold | -55 °C | 125 °C | 18 | Beryllium Copper | Brass | Gold | Wire Wrap | 3 A | UL94 V-0 | 0.3 " | 7.62 mm | DIP | ||
Aries Electronics | Through Hole | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.5 in | 12.7 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Open Frame | Gold | -55 °C | 125 °C | 18 | Beryllium Copper | Brass | Gold | Wire Wrap | 3 A | UL94 V-0 | 0.3 " | 7.62 mm | DIP | ||
Aries Electronics | Through Hole | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Open Frame | Tin | -55 °C | 105 ░C | 18 | Beryllium Copper | Brass | Gold | Wire Wrap | 3 A | UL94 V-0 | 0.3 " | 7.62 mm | DIP | 0.36 in | 9.14 mm | ||
Aries Electronics | Through Hole | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Open Frame | Tin | -55 °C | 105 ░C | 18 | Beryllium Copper | Brass | Gold | Wire Wrap | 3 A | UL94 V-0 | 0.3 " | 7.62 mm | DIP | 0.36 in | 9.14 mm |