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CONN IC DIP SOCKET 32POS TIN
| Part | Housing Material | Contact Finish - Post | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Type | Type | Type | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | Tin | 1.5 A | 200 µin | 5.08 µm | Closed Frame | Phosphor Bronze | 0.1 in | 2.54 mm | Phosphor Bronze | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | 2 x 16 | 32 | 0.15 in | 3.81 mm | 105 ░C | -55 °C | Bottom Entry Through Board Through Hole | UL94 V-0 | 5.08 µm | 200 µin | Solder |