30-9503 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Contact Material - Mating	Features	Current Rating (Amps)	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Type	Type	Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Post	Mounting Type	Termination	Pitch - Post	Pitch - Post	Contact Finish - Post	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 30-9503-30	Beryllium Copper	Closed Frame	3 A	30	2	15	200 µin	5.08 µm	UL94 V-0	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	22.86 mm	DIP	0.9 in	105 ░C	-55 °C	Phosphor Bronze	Through Hole	Wire Wrap	2.54 mm	0.1 in	Tin	0.5 in	12.7 mm	0.1 in	2.54 mm	Gold
Aries Electronics 30-9503-20	Beryllium Copper	Closed Frame	3 A	30	2	15	200 µin	5.08 µm	UL94 V-0	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	22.86 mm	DIP	0.9 in	105 ░C	-55 °C	Phosphor Bronze	Through Hole	Wire Wrap	2.54 mm	0.1 in	Tin			0.1 in	2.54 mm	Gold	0.36 in	9.14 mm