36-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS TIN

Part	Pitch - Post	Pitch - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Post	Contact Material - Mating	Number of Positions or Pins (Grid)	Features	Material Flammability Rating	Housing Material	Termination	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Type	Type	Type
Aries Electronics 36-6575-16	2.54 mm	0.1 in	Tin	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Beryllium Copper	36	Closed Frame	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.11 in	2.78 mm	5.08 µm	200 µin	200 µin	5.08 µm	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 36-6575-10	2.54 mm	0.1 in	Tin	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Beryllium Copper	36	Closed Frame	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.11 in	2.78 mm	5.08 µm	200 µin	200 µin	5.08 µm	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "