24-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Material Flammability Rating	Termination Post Length	Current Rating	Row Spacing	Type	Housing Material	Pitch - Post	Termination	Contact Material - Mating	Contact Finish - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish - Post	Features	Contact Material - Post	Pitch - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Aries Electronics 24-6571-11	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Solder	Beryllium Copper	Gold	2	24	12	Gold	Closed Frame	Beryllium Copper	0.1 in	Through Hole	10 µin	10 µin
Aries Electronics 24-6571-16	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Solder	Beryllium Nickel	Boron Nickel	2	24	12	Nickel Boron	Closed Frame	Beryllium Nickel	0.1 in	Through Hole	50 µin	50 µin
Aries Electronics 24-6571-10	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Solder	Beryllium Copper	Tin	2	24	12	Tin	Closed Frame	Beryllium Copper	0.1 in	Through Hole	200 Ąin	200 µin