Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Contact Finish - Post | Pitch - Post | Pitch - Post | Features | Mounting Type | Current Rating (Amps) | Termination | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Nickel Boron | 2.54 mm | 0.1 in | Closed Frame | Through Hole | 1 A | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 1.27 µm | 50 µin | Beryllium Nickel | UL94 V-0 | Beryllium Nickel | Nickel Boron | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 1.27 µm | 50 µin | 24 |
Aries Electronics | Tin | 2.54 mm | 0.1 in | Closed Frame | Through Hole | 1 A | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 5.08 µm | 200 µin | Beryllium Copper | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | 24 |