CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Post | Features | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Type | Mounting Type | Termination Post Length | Termination Post Length | Contact Material - Post | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Tin | Closed Frame | Solder | 200 µin | 5.08 µm | 1 A | 0.1 in | 2.54 mm | PGA ZIF (ZIP) | Through Hole | 3.18 mm | 0.125 in | Beryllium Copper | Beryllium Copper | 125 °C | -65 ░C | Gold | UL94 V-0 | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám |
Aries Electronics | Tin | Closed Frame | Solder | 200 µin | 5.08 µm | 1 A | 0.1 in | 2.54 mm | PGA ZIF (ZIP) | Through Hole | 3.18 mm | 0.125 in | Beryllium Copper | Beryllium Copper | 125 °C | -65 ░C | Gold | UL94 V-0 | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám |
Aries Electronics | Tin | Closed Frame | Solder | 200 µin | 5.08 µm | 1 A | 0.1 in | 2.54 mm | PGA ZIF (ZIP) | Through Hole | 3.18 mm | 0.125 in | Beryllium Copper | Beryllium Copper | 125 °C | -65 ░C | Gold | UL94 V-0 | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám |