CONN SOCKET SIP 20POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Material - Mating | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Contact Finish - Post | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Number of Positions or Pins (Grid) [custom] | Contact Finish - Mating | Termination Post Length | Termination Post Length | Mounting Type | Material Flammability Rating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) SIP1X20-011BLF | 2.54 mm | 0.1 in | Beryllium Copper | SIP | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS), Glass Filled | Tin | Brass | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Solder | 20 | Gold | 3.18 mm | 0.125 in | Through Hole | UL94 V-0 | Closed Frame |
Amphenol ICC (FCI) SIP1X20-011B | 2.54 mm | 0.1 in | Beryllium Copper | SIP | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS), Glass Filled | Tin-Lead | Brass | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Solder | 20 | Gold | 3.18 mm | 0.125 in | Through Hole | UL94 V-0 | Closed Frame |
Amphenol ICC (FCI) SIP1X20-041BLF | 2.54 mm | 0.1 in | Beryllium Copper | SIP | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS), Glass Filled | Tin | Brass | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | Solder | 20 | Gold | 3.18 mm | 0.125 in | Through Hole | UL94 V-0 | Closed Frame |
Amphenol ICC (FCI) SIP1X20-041B | 2.54 mm | 0.1 in | Beryllium Copper | SIP | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS), Glass Filled | Tin-Lead | Brass | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | Solder | 20 | Gold | 3.18 mm | 0.125 in | Through Hole | UL94 V-0 | Closed Frame |