Beta
⌘K
CONN IC DIP SOCKET 36POS GOLD
| Part | Contact Material - Mating | Housing Material | Contact Finish - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Type | Type | Type | Number of Positions or Pins (Grid) | Mounting Type | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | 3.56 mm | 0.14 in | 3 A | 2.54 mm | 0.1 in | Gold | Closed Frame Elevated | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Solder | 105 ░C | -55 °C | Brass | DIP | 0.6 in | 15.24 mm | 36 | Through Hole | UL94 V-0 | 10 çin | 0.25 çm |