12-3513 Series

Catalog

CONN IC DIP SOCKET 12POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Material - Mating	Features	Pitch - Mating	Termination	Contact Finish Thickness - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Row Spacing	Type	Housing Material	Mounting Type	Contact Material - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns
Aries Electronics 12-3513-10H	0.125 in	UL94 V-0	3 A	Beryllium Copper	Closed Frame	0.1 in	Solder	200 µin	0.1 in	10 µin	Tin	Gold	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	Brass	2	12 count	6 count
Aries Electronics 12-3513-10T	0.125 in	UL94 V-0	3 A	Beryllium Copper	Closed Frame	0.1 in	Solder	200 µin	0.1 in	10 µin	Tin	Gold	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	Brass	2	12 count	6 count
Aries Electronics 12-3513-11H	0.125 in	UL94 V-0	3 A	Beryllium Copper	Closed Frame	0.1 in	Solder	10 µin	0.1 in	10 µin	Gold	Gold	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	Brass	2	12 count	6 count