FOLC-140 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN RCPT 160POS 0.05 GOLD PCB
| Part | Connector Type | Contact Finish - Post | Style | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Mating | Contact Length - Post | Mounting Type | Pitch - Mating | Row Spacing - Mating | Number of Positions Loaded | Insulation Color | Contact Type | Termination | Current Rating (Per Contact) | Features | Contact Finish Thickness - Mating | Insulation Height | Fastening Type | Number of Positions | Material Flammability Rating | Number of Rows | Contact Shape | Insulation Material | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.12 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Board Lock | 30 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper |
 Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | Surface Mount | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Pick and Place | 30 µin | 0.178 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
 Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.075 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | 10 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.075 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Board Lock | 30 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper |
 Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.075 in | Surface Mount Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | 30 µin | 0.185 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.075 in | Surface Mount Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Board Lock | 30 µin | 0.185 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper |
Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.12 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | 30 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
 Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.075 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | 30 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | Surface Mount | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Board Lock Pick and Place | 30 µin | 0.178 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | |
Samtec Inc. | Receptacle | Tin | Board | 125 °C | -55 °C | Gold | 0.12 in | Through Hole | 0.05 in | 0.05 in | All | Black | Female Socket | Solder | 2.6 A | Board Lock | 10 µin | 0.18 in | Push-Pull | 160 | UL94 V-0 | 4 | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper |