CONN HEADER SMD 28POS 1MM
| Part | Contact Type | Number of Positions | Pitch - Mating | Pitch - Mating | Number of Rows | Number of Positions Loaded | Row Spacing - Mating | Row Spacing - Mating | Mounting Type | Fastening Type | Current Rating (Amps) | Connector Type | Insulation Height | Insulation Height | Contact Material | Contact Finish - Post | Shrouding | Contact Finish - Mating | Insulation Material | Termination | Contact Shape | Features | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Color | Contact Length - Mating | Contact Length - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Mating [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | Pick and Place | -55 °C | 125 °C | Black | 0.065 in | 1.65 mm | 3 µin | 0.076 µm | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | End Shrouds | -55 °C | 125 °C | Black | 0.065 in | 1.65 mm | 10 çin | 0.25 çm | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | End Shrouds | -55 °C | 125 °C | Black | 10 çin | 0.25 çm | 1.9 mm | 0.075 in | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | -55 °C | 125 °C | Black | 0.065 in | 1.65 mm | 3 µin | 0.076 µm | |||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | End Shrouds Pick and Place | -55 °C | 125 °C | Black | 3 µin | 0.076 µm | 1.9 mm | 0.075 in | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | Pick and Place | -55 °C | 125 °C | Black | 3 µin | 0.076 µm | 1.9 mm | 0.075 in | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | Pick and Place | -55 °C | 125 °C | Black | 10 çin | 0.25 çm | 1.9 mm | 0.075 in | ||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | -55 °C | 125 °C | Black | 10 çin | 0.25 çm | 1.9 mm | 0.075 in | |||
Samtec Inc. | Male Pin | 28 | 0.039 in | 1 mm | 2 | All | 0.039 " | 1 mm | Surface Mount | Push-Pull | 2.8 A per Contact | Cuttable Header | 0.038 in | 0.97 mm | Phosphor Bronze | Tin | Unshrouded | Gold | Liquid Crystal Polymer (LCP) | Solder | Square | -55 °C | 125 °C | Black | 0.065 in | 1.65 mm | 10 çin | 0.25 çm |