HEATSINK DPAK SMT TIN PLATED
| Part | Width | Width | Fin Height [z] | Fin Height [z] | Power Dissipation @ Temperature Rise | Package Cooled | Shape | Attachment Method | Thermal Resistance @ Forced Air Flow | Type | Material Finish | Thermal Resistance @ Natural | Material | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette 217-36CTE6 | 15.24 mm | 0.6 in | 0.36 in | 9.14 mm | 1 W, 55 °C | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | Rectangular, Fins | SMD Pad | 16 °C/W, 200 LFM | Top Mount | Tin | 55 °C/W | Copper | 18.8 mm | 0.74 in |
Wakefield-Vette 217-36CTRE6 | 15.24 mm | 0.6 in | 0.36 in | 9.14 mm | 1 W, 55 °C | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | Rectangular, Fins | SMD Pad | 16 °C/W, 200 LFM | Top Mount | Tin | 55 °C/W | Copper | 18.8 mm | 0.74 in |