
MCP6492 Series
Manufacturer: Microchip Technology
DUAL 8 MHZ OP, E TEMP 8 MSOP 3X3MM T/R ROHS COMPLIANT: YES
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Output Type | Amplifier Type | Package Width | Package Name | Package Length | Gain Bandwidth Product | Slew Rate | Voltage - Input Offset | Mounting Type | Number of Circuits | Current - Output / Channel | Voltage - Supply Span (Min) | Current - Supply | Current - Input Bias | Voltage - Supply Span (Max) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 125 °C | -40 °C | Rail-to-Rail | General Purpose | 3 mm | 8-MSOP 8-TSSOP 8-MSOP | 0.118 in | 7.5 MHz | 6 V/µs | 1.5 mV | Surface Mount | 2 | 15 mA | 2.4 V | 530 µA | 1 pA | 5.5 V | |
Microchip Technology | 125 °C | -40 °C | Rail-to-Rail | General Purpose | 3 mm | 8-TDFN | 2 mm | 7.5 MHz | 6 V/µs | 1.5 mV | Surface Mount | 2 | 15 mA | 2.4 V | 530 µA | 1 pA | 5.5 V | 8-WFDFN Exposed Pad |
Microchip Technology | 125 °C | -40 °C | Rail-to-Rail | General Purpose | 3.9 mm | 8-SOIC | 0.154 in | 7.5 MHz | 6 V/µs | 1.5 mV | Surface Mount | 2 | 15 mA | 2.4 V | 530 µA | 1 pA | 5.5 V | |
Microchip Technology | 125 °C | -40 °C | Rail-to-Rail | General Purpose | 3 mm | 8-MSOP 8-TSSOP 8-MSOP | 0.118 in | 7.5 MHz | 6 V/µs | 1.5 mV | Surface Mount | 2 | 15 mA | 2.4 V | 530 µA | 1 pA | 5.5 V | |
Microchip Technology | 125 °C | -40 °C | Rail-to-Rail | General Purpose | 3.9 mm | 8-SOIC | 0.154 in | 7.5 MHz | 6 V/µs | 1.5 mV | Surface Mount | 2 | 15 mA | 2.4 V | 530 µA | 1 pA | 5.5 V |