HTSW-210 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN HEADER R/A 10POS 5.08MM
| Part | Insulation Color | Shrouding | Contact Finish - Mating | Contact Length - Mating | Contact Shape | Contact Length - Post | Number of Positions | Insulation Height | Contact Type | Contact Finish Thickness - Mating | Connector Type | Number of Rows | Operating Temperature (Max) | Operating Temperature (Min) | Current Rating | Current Rating | Mounting Type | Insulation Material | Termination | Pitch - Mating | Contact Material | Contact Finish - Post | Style | Material Flammability Rating | Number of Positions Loaded | Fastening Type | Contact Finish Thickness - Post | Overall Contact Length | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Natural | Unshrouded | Gold | 0.32 in | Square | 0.1 in | 10 | 0.122 in | Male Pin | 10 µin | Header | 1 | 125 °C | -55 °C | 0 A | Varies by Wire Gauge | Right Angle Through Hole | Liquid Crystal Polymer (LCP) | Solder | 0.2 in | Phosphor Bronze | Gold | Board Board or Cable | UL94 V-0 | All | Push-Pull | 3 µin | ||
 Samtec Inc. | Natural | Unshrouded | Tin | 0.62 in | Square | 0.11 in | 20 | 0.1 in | Male Pin | Header | 2 | 105 °C | -55 °C | 0 A | Varies by Wire Gauge | Through Hole | Liquid Crystal Polymer (LCP) | Solder | 0.2 in | Phosphor Bronze | Tin | Board Board or Cable | UL94 V-0 | All | Push-Pull | 0.83 in | 0.1 in |