ESQT-121 Series
Manufacturer: Samtec Inc.
CONN SOCKET 42POS 0.079 GOLD PCB
| Part | Insulation Material | Mounting Type | Connector Type | Fastening Type | Contact Finish - Mating | Contact Shape | Contact Finish Thickness - Mating | Style | Insulation Height | Operating Temperature (Max) | Operating Temperature (Min) | Number of Rows | Termination | Pitch - Mating | Contact Finish - Post | Current Rating (Per Contact) | Contact Type | Row Spacing - Mating | Contact Material | Contact Length - Post | Insulation Color | Number of Positions Loaded | Material Flammability Rating | Number of Positions | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 3 µin | Board Board or Cable | 0.67 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.18 in | Black | All | UL94 V-0 | 42 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 10 µin | Board Board or Cable | 0.725 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.125 in | Black | All | UL94 V-0 | 42 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 10 µin | Board Board or Cable | 0.596 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.254 in | Black | All | UL94 V-0 | 42 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 20 Ąin | Board Board or Cable | 0.71 in | 125 °C | -55 °C | 3 | Solder | 0.079 in | Gold | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.14 in | Black | All | UL94 V-0 | 63 | 3 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 3 µin | Board Board or Cable | 0.73 in | 125 °C | -55 °C | 4 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.12 in | Black | All | UL94 V-0 | 84 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 10 µin | Board Board or Cable | 0.596 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.254 in | Black | All | UL94 V-0 | 42 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 20 Ąin | Board Board or Cable | 0.56 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Gold | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.29 in | Black | All | UL94 V-0 | 42 | 3 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 10 µin | Board Board or Cable | 0.335 in | 125 °C | -55 °C | 1 | Solder | 0.079 in | Tin | 4.5 A | Forked | Phosphor Bronze | 0.123 in | Black | All | UL94 V-0 | 21 | ||
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 3 µin | Board Board or Cable | 0.5 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.35 in | Black | All | UL94 V-0 | 42 | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Through Hole | Elevated Socket | Push-Pull | Gold | Square | 20 Ąin | Board Board or Cable | 0.315 in | 125 °C | -55 °C | 2 | Solder | 0.079 in | Tin | 4.5 A | Forked | 0.079 in | Phosphor Bronze | 0.143 in | Black | All | UL94 V-0 | 42 |