20-3513 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Material Flammability Rating	Termination Post Length	Current Rating	Mounting Type	Contact Material - Post	Termination	Contact Finish Thickness - Mating	Pitch - Mating	Row Spacing	Type	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish - Post	Contact Finish Thickness - Post	Pitch - Post	Contact Material - Mating	Features	Contact Finish - Mating	Housing Material
Aries Electronics 20-3513-10T	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Tin	200 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 20-3513-10H	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Tin	200 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 20-3513-00	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Tin	200 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 20-3513-11H	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Gold	10 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 20-3513-10	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Tin	200 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 20-3513-11	UL94 V-0	0.125 in	3 A	Through Hole	Brass	Solder	10 µin	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	2	10	20	-55 °C	105 °C	Gold	10 µin	0.1 in	Beryllium Copper	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide