CONN IC DIP SOCKET 20POS GOLD
| Part | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Material Flammability Rating | Termination Post Length | Termination Post Length | Termination | Current Rating (Amps) | Housing Material | Features | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Tin | Gold |
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Tin | Gold |
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Tin | Gold |
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Gold | Gold |
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Tin | Gold |
Aries Electronics | Through Hole | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | UL94 V-0 | 3.18 mm | 0.125 in | Solder | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame | 20 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper | Brass | Gold | Gold |