24-3554 Series

Catalog

24P DIP NICKEL BORON BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Termination	Material Flammability Rating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Housing Material	Mounting Type	Termination Post Length	Termination Post Length	Contact Finish - Mating	Features	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 24-3554-16	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin	Nickel Boron	Solder	UL94 V-0	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	24	1.27 µm	50 µin	1 A	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	Nickel Boron	Closed Frame	2.54 mm	0.1 in
Aries Electronics 24-3554-18	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin	Nickel Boron	Solder	UL94 V-0	Beryllium Nickel	0.1 in	2.54 mm	Beryllium Nickel	24	1.27 µm	50 µin	1 A	Polyetheretherketone (PEEK) Glass Filled	Through Hole	0.11 in	2.78 mm	Nickel Boron	Closed Frame	2.54 mm	0.1 in	-55 °C	250 °C
Aries Electronics 24-3554-10	7.62 mm	0.3 in	DIP ZIF (ZIP)	5.08 µm	200 µin	Tin	Solder	UL94 V-0	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	24	5.08 µm	200 µin	1 A	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm		Closed Frame	2.54 mm	0.1 in