CONN DIFF ARRAY RCP 64P SMD GOLD
| Part | Contact Finish Thickness | Contact Finish Thickness | Mated Stacking Heights | Features | Contact Finish | Number of Rows | Pitch [x] | Pitch [x] | Mounting Type | Height Above Board | Height Above Board | Connector Type | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.76 Ám | 30 Áin | 5 mm | Ground Bus (Plane) | Gold | 2 | 0.64 mm | 0.025 in | Surface Mount | 0.143 in | 3.63 mm | Differential Pair Array Female | 64 |
Samtec Inc. | 0.076 Ám | 3 Áin | 5 mm | Board Guide Ground Bus (Plane) Mating Guide | Gold | 2 | 0.64 mm | 0.025 in | Surface Mount | 0.143 in | 3.63 mm | Differential Pair Array Female | 64 |
Samtec Inc. | 0.25 Ám | 10 Áin | 5 mm | Board Lock Ground Bus (Plane) Mating Guide | Gold | 2 | 0.64 mm | 0.025 in | Surface Mount | 0.143 in | 3.63 mm | Differential Pair Array Female | 64 |
Samtec Inc. | 0.076 Ám | 3 Áin | Ground Bus (Plane) Solder Retention | Gold | 2 | 0.64 mm | 0.025 in | Surface Mount Right Angle | 0.328 in | 8.33 mm | Differential Pair Array Female | 64 | |
Samtec Inc. | 0.76 Ám | 30 Áin | Ground Bus (Plane) Solder Retention | Gold | 2 | 0.64 mm | 0.025 in | Surface Mount Right Angle | 0.328 in | 8.33 mm | Differential Pair Array Female | 64 |