SOCKET ADAPTER DIP TO 28SOIC
| Part | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Housing Material | Convert To (Adapter End) | Contact Finish - Post | Contact Material - Mating | Number of Pins | Pitch - Post | Pitch - Post | Termination | Material Flammability Rating | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Mounting Type | Termination Post Length | Termination Post Length | Operating Temperature | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 10 çin | 0.25 çm | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | SOIC | Gold | Beryllium Copper | 28 | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 3 A | 10 çin | 0.25 çm | DIP | 0.3 in | 7.62 mm | Surface Mount | |||||
Aries Electronics | Gold | 10 çin | 0.25 çm | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | SOIC | Gold | Beryllium Copper | 28 | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 3 A | 10 çin | 0.25 çm | DIP | 0.3 in | 7.62 mm | Surface Mount | 0.76 mm | 0.03 in | |||
Aries Electronics | Gold | 10 çin | 0.25 çm | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | SOIC | Gold | Beryllium Copper | 28 | 1.27 mm | 0.05 in | Solder | UL94 V-0 | 3 A | 10 çin | 0.25 çm | DIP | 0.3 in | 7.62 mm | Surface Mount | 105 C | 0.1 in | 2.54 mm |