32-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post	Material Flammability Rating	Mounting Type	Housing Material	Contact Finish - Mating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Features	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 32-3554-18	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in	1.27 µm	50 µin	2 x 16	32	Beryllium Nickel	UL94 V-0	Through Hole	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	1 A	0.1 in	2.54 mm	Beryllium Nickel	Closed Frame	Solder	-55 °C	250 °C	0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin
Aries Electronics 32-3554-10	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in	5.08 µm	200 µin	2 x 16	32	Beryllium Copper	UL94 V-0	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled		1 A	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder			0.11 in	2.78 mm	Tin	5.08 µm	200 µin
Aries Electronics 32-3554-16	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in	1.27 µm	50 µin	2 x 16	32	Beryllium Copper	UL94 V-0	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	1 A	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder			0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin