YTT Series | Samtec Inc. | Zenode.ai

Catalog

Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Terminal Strip\/

Part	Contact Finish Thickness - Mating	Row Spacing - Mating	Number of Positions	Insulation Height	Contact Length - Post	Insulation Material	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Mounting Type	Contact Material	Contact Length - Mating	Insulation Color	Connector Type	Contact Finish - Post	Contact Type	Contact Shape	Number of Positions Loaded	Termination	Number of Rows	Overall Contact Length	Pitch - Mating	Shrouding	Contact Finish - Mating	Style	Contact Finish Thickness - Post
Samtec Inc. YTT-116-01-G-Q	20 Ąin	0.079 in	64	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Gold	Male Pin	Square	All	Solder	4	0.302 in	0.079 in	Unshrouded	Gold	Board	3 µin
Samtec Inc. YTT-120-01-S-6	30 µin	0.079 in	120	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	6	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-108-01-G-Q	20 Ąin	0.079 in	32	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Gold	Male Pin	Square	All	Solder	4	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-123-01-F-5	3 µin	0.079 in	115	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	5	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-110-01-L-5	10 µin	0.079 in	50	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	5	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-136-01-F-Q	3 µin	0.079 in	144	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	4	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-113-01-T-Q		0.079 in	52	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	105 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	4	0.302 in	0.079 in	Unshrouded	Tin	Board
Samtec Inc. YTT-120-01-F-5	3 µin	0.079 in	100	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	5	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-124-01-L-6	10 µin	0.079 in	144	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Tin	Male Pin	Square	All	Solder	6	0.302 in	0.079 in	Unshrouded	Gold	Board
Samtec Inc. YTT-112-01-G-6	20 Ąin	0.079 in	72	0.079 in	0.097 in	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	Push-Pull	Through Hole	Phosphor Bronze	0.126 in	Black	Header	Gold	Male Pin	Square	All	Solder	6	0.302 in	0.079 in	Unshrouded	Gold	Board	3 µin