20-0503 Series

Catalog

CONN SOCKET SIP 20POS GOLD

Part	Contact Material - Mating	Type	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Finish - Post	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Termination Post Length [x]	Termination Post Length [x]	Pitch - Post	Pitch - Post	Current Rating (Amps)
Aries Electronics 20-0503-20	Beryllium Copper	SIP	Through Hole	30 Áin	0.76 Ám	UL94 HB	Tin	Brass	20	200 µin	5.08 µm	Gold	Polyamide (PA) Nylon Glass Filled	0.1 in	2.54 mm	Wire Wrap	0.36 in	9.14 mm	2.54 mm	0.1 in	3 A
Aries Electronics 20-0503-21	Beryllium Copper	SIP	Through Hole	30 Áin	0.76 Ám	UL94 HB	Gold	Brass	20	10 çin	0.25 çm	Gold	Polyamide (PA) Nylon Glass Filled	0.1 in	2.54 mm	Wire Wrap	0.36 in	9.14 mm	2.54 mm	0.1 in	3 A