14-8400 Series

Catalog

CONN IC DIP SOCKET 14POS TIN

Part	Features	Termination Post Length	Termination Post Length	Termination	Contact Material - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Housing Material	Contact Finish - Post	Material Flammability Rating	Contact Finish - Mating	Contact Material - Post [custom]
Aries Electronics 14-8400-10	Closed Frame Elevated	3.56 mm	0.14 in	Solder	Phosphor Bronze	14	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	5.08 µm	200 µin	1 A	200 µin	5.08 µm	Phosphor Bronze	Through Hole	105 ░C	-55 °C	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	UL94 V-0
Aries Electronics 14-8400-310C	Closed Frame Elevated	3.56 mm	0.14 in	Solder		14	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	0.76 Ám	30 Áin	3 A	10 çin	0.25 çm	Beryllium Copper	Through Hole	105 ░C	-55 °C	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	UL94 V-0	Gold	Brass
Aries Electronics 14-8400-10WR	Closed Frame Elevated	3.56 mm	0.14 in	Solder	Phosphor Bronze	14	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	5.08 µm	200 µin	1 A	200 µin	5.08 µm	Phosphor Bronze	Through Hole	105 ░C	-55 °C	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	UL94 V-0