28-1518 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Contact Material - Mating	Features	Housing Material	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Contact Finish - Post	Pitch - Post	Pitch - Post	Material Flammability Rating	Termination Post Length	Termination Post Length	Type	Type	Type	Termination	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 28-1518-10	Beryllium Copper	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	0.1 in	2.54 mm	10 çin	0.25 çm	28	3 A	Tin	2.54 mm	0.1 in	UL94 V-0	3.18 mm	0.125 in	DIP	5.08 mm	0.2 in	Solder	Gold	Brass	200 µin	5.08 µm
Aries Electronics 28-1518-11H	Beryllium Copper	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	0.1 in	2.54 mm	10 çin	0.25 çm	28	3 A	Gold	2.54 mm	0.1 in	UL94 V-0	3.18 mm	0.125 in	DIP	5.08 mm	0.2 in	Solder	Gold	Brass	10 çin	0.25 çm
Aries Electronics 28-1518-11	Beryllium Copper	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	0.1 in	2.54 mm	10 çin	0.25 çm	28	3 A	Gold	2.54 mm	0.1 in	UL94 V-0	3.18 mm	0.125 in	DIP	5.08 mm	0.2 in	Solder	Gold	Brass	10 çin	0.25 çm
Aries Electronics 28-1518-10H	Beryllium Copper	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	0.1 in	2.54 mm	10 çin	0.25 çm	28	3 A	Tin	2.54 mm	0.1 in	UL94 V-0	3.18 mm	0.125 in	DIP	5.08 mm	0.2 in	Solder	Gold	Brass	200 µin	5.08 µm