ESW-136 Series
Manufacturer: Samtec Inc.
CONN SOCKET 72POS 0.1 GOLD PCB
| Part | Contact Type | Contact Length - Post | Contact Finish - Mating | Connector Type | Pitch - Mating | Number of Rows | Insulation Color | Voltage Rating | Termination | Material Flammability Rating | Insulation Height | Mounting Type | Contact Finish Thickness - Mating | Number of Positions | Fastening Type | Contact Finish - Post | Number of Positions Loaded | Operating Temperature (Max) | Operating Temperature (Min) | Current Rating (Per Contact) | Style | Row Spacing - Mating | Contact Shape | Contact Material | Insulation Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Forked | 0.19 in | Gold | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.535 in | Through Hole | 30 µin | 72 | Push-Pull | Tin | All | 125 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Forked | 0.29 in | Tin | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.435 in | Through Hole | 72 | Push-Pull | Tin | All | 105 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Forked | 0.18 in | Gold | Elevated Socket | 0.1 in | 1 | Black | 550 V | Solder | UL94 V-0 | 0.735 in | Through Hole | 30 µin | 36 | Push-Pull | Tin | All | 125 °C | -55 °C | 5.2 A | Board | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Forked | 0.29 in | Gold | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.435 in | Through Hole | 20 Ąin | 72 | Push-Pull | Gold | All | 125 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 3 µin |
Samtec Inc. | Forked | 0.18 in | Gold | Elevated Socket | 0.1 in | 1 | Black | 550 V | Solder | UL94 V-0 | 0.735 in | Through Hole | 20 Ąin | 36 | Push-Pull | Gold | All | 125 °C | -55 °C | 5.2 A | Board | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 3 µin | |
Samtec Inc. | Forked | 0.28 in | Tin | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.635 in | Through Hole | 72 | Push-Pull | Tin | All | 105 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Forked | 0.19 in | Tin | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.535 in | Through Hole | 72 | Push-Pull | Tin | All | 105 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Forked | 0.29 in | Gold | Elevated Socket | 0.1 in | 1 | Black | 550 V | Solder | UL94 V-0 | 0.435 in | Through Hole | 10 µin | 36 | Push-Pull | Tin | All | 125 °C | -55 °C | 5.2 A | Board | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Forked | 0.09 in | Gold | Elevated Socket | 0.1 in | 2 | Black | 550 V | Kinked Pin Solder | UL94 V-0 | 0.635 in | Through Hole | 30 µin | 72 | Push-Pull | Tin | All | 125 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Forked | 0.18 in | Gold | Elevated Socket | 0.1 in | 2 | Black | 550 V | Solder | UL94 V-0 | 0.735 in | Through Hole | 30 µin | 72 | Push-Pull | Tin | All | 125 °C | -55 °C | 5.2 A | Board | 0.1 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |