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CONN IC DIP SOCKET 16POS GOLD
| Part | Mounting Type | Contact Material - Post [custom] | Termination | Material Flammability Rating | Termination Post Length | Termination Post Length | Housing Material | Pitch - Post | Pitch - Post | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Post | Type | Type | Type | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | Brass | Solder | UL94 V-0 | 3.56 mm | 0.14 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 3 A | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 16 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Closed Frame Elevated | Gold | DIP | 0.6 in | 15.24 mm | Beryllium Copper | Gold |
Aries Electronics | Through Hole | Brass | Solder | UL94 V-0 | 3.56 mm | 0.14 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 3 A | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 16 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Closed Frame Elevated | Gold | DIP | 0.3 " | 7.62 mm | Beryllium Copper | Gold |