IC FLASH 64MBIT SPI/QUAD 8USON
| Part | Memory Organization | Operating Temperature [Min] | Operating Temperature [Max] | Clock Frequency | Access Time | Memory Type | Memory Size | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Voltage - Supply [Max] | Voltage - Supply [Min] | Technology | Supplier Device Package | Memory Interface | Memory Format | Package / Case | Mounting Type | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited GD25LE64EXEEGR | 8M x 8 | -40 °C | 125 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 100 µs | 4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-FO-USON (3x2) | QPI, Quad I/O, SPI | FLASH | 8-XFDFN Exposed Pad | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64ETIGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-SOP | QPI, Quad I/O, SPI | FLASH | 8-SOIC | Surface Mount | 3.9 mm | 0.154 in |
GigaDevice Semiconductor (HK) Limited GD25LE64EQIGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-USON (4x4) | QPI, Quad I/O, SPI | FLASH | 8-XDFN Exposed Pad | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64ESIGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-SOP | QPI, Quad I/O, SPI | FLASH | 8-SOIC | Surface Mount | 5.3 mm | 0.209 " |
GigaDevice Semiconductor (HK) Limited GD25LE64ELIGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 16-WLCSP | QPI, Quad I/O, SPI | FLASH | 16-XFBGA, WLCSP | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64E3IGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-WLCSP | QPI, Quad I/O, SPI | FLASH | 8-XFBGA, WLCSP | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64EWIGR | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-WSON (5x6) | QPI, Quad I/O, SPI | FLASH | 8-WDFN Exposed Pad | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64ENEGR | 8M x 8 | -40 °C | 125 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 100 µs | 4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-USON (3x4) | QPI, Quad I/O, SPI | FLASH | 8-UDFN Exposed Pad | Surface Mount | ||
GigaDevice Semiconductor (HK) Limited GD25LE64ESIGY | 8M x 8 | -40 °C | 85 °C | 133 MHz | 6 ns | Non-Volatile | 64 Gbit | 60 µs | 2.4 ms | 2 V | 1.65 V | FLASH - NOR (SLC) | 8-SOP | QPI, Quad I/O, SPI | FLASH | 8-SOIC | Surface Mount | 5.3 mm | 0.209 " |