16-1518 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Contact Material - Mating	Termination	Pitch - Post	Pitch - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Finish - Mating	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Housing Material	Mounting Type	Contact Finish - Post	Features
Aries Electronics 16-1518-11H	10 çin	0.25 çm	16	DIP	5.08 mm	0.2 in	Beryllium Copper	Solder	2.54 mm	0.1 in	UL94 V-0	0.1 in	2.54 mm	Brass	Gold	3 A	10 çin	0.25 çm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 16-1518-11	10 çin	0.25 çm	16	DIP	5.08 mm	0.2 in	Beryllium Copper	Solder	2.54 mm	0.1 in	UL94 V-0	0.1 in	2.54 mm	Brass	Gold	3 A	10 çin	0.25 çm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 16-1518-10	200 µin	5.08 µm	16	DIP	5.08 mm	0.2 in	Beryllium Copper	Solder	2.54 mm	0.1 in	UL94 V-0	0.1 in	2.54 mm	Brass	Gold	3 A	10 çin	0.25 çm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Tin	Open Frame
Aries Electronics 16-1518-10T	200 µin	5.08 µm	16	DIP	5.08 mm	0.2 in	Beryllium Copper	Solder	2.54 mm	0.1 in	UL94 V-0	0.1 in	2.54 mm	Brass	Gold	3 A	10 çin	0.25 çm	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Tin	Open Frame