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CONN IC DIP SOCKET 26POS GOLD
| Part | Contact Material - Post [custom] | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Type | Type | Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Termination | Housing Material | Contact Finish - Post | Termination Post Length | Termination Post Length | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | Through Hole | 10 çin | 0.25 çm | Closed Frame | 3 A | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | 105 ░C | -55 °C | Gold | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | 3.18 mm | 0.125 in | UL94 V-0 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Beryllium Copper |
Aries Electronics | Brass | Through Hole | 10 çin | 0.25 çm | Closed Frame | 3 A | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | 105 ░C | -55 °C | Gold | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | Tin | 3.18 mm | 0.125 in | UL94 V-0 | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | Beryllium Copper |