CONN SOCKET 156P 0.079 GOLD PCB
| Part | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Style | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Fastening Type | Connector Type | Contact Finish - Mating | Insulation Height | Insulation Height | Insulation Material | Contact Material | Contact Type | Contact Length - Post | Contact Length - Post | Contact Finish - Post | Pitch - Mating [x] | Pitch - Mating [x] | Number of Positions Loaded | Row Spacing - Mating | Row Spacing - Mating | Insulation Color | Current Rating (Amps) | Termination | Material Flammability Rating | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Post [x] | Contact Length - Post [x] | Number of Positions | Number of Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Through Hole | -55 °C | 125 °C | Board to Board Cable | 3 µin | 0.076 µm | Push-Pull | Elevated Socket | Gold | 0.693 in | 17.6 mm | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Forked | 0.157 in | 4 mm | Gold | 0.079 in | 2 mm | All | 0.079 in | 2 mm | Black | 4.5 A | Solder | UL94 V-0 | Square | 0.51 µm | 20 µin | ||||
Samtec Inc. | Through Hole | -55 °C | 125 °C | Board to Board Cable | 3 µin | 0.076 µm | Push-Pull | Elevated Socket | Gold | 0.535 in | 13.6 mm | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Forked | Gold | 0.079 in | 2 mm | All | 0.079 in | 2 mm | Black | 4.5 A | Solder | UL94 V-0 | Square | 0.51 µm | 20 µin | 0.315 in | 8 mm | 78 | 2 | ||
Samtec Inc. | Through Hole | -55 °C | 125 °C | Board to Board Cable | Push-Pull | Elevated Socket | Gold | 0.693 in | 17.6 mm | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Forked | 0.157 in | 4 mm | Tin | 0.079 in | 2 mm | All | 0.079 in | 2 mm | Black | 4.5 A | Solder | UL94 V-0 | Square | 0.51 µm | 20 µin | 78 | 2 | ||||
Samtec Inc. | Through Hole | -55 °C | 125 °C | Board to Board Cable | 3 µin | 0.076 µm | Push-Pull | Elevated Socket | Gold | 0.31 in | 7.87 mm | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Forked | 0.148 in | 3.76 mm | Gold | 0.079 in | 2 mm | All | 0.079 in | 2 mm | Black | 4.5 A | Solder | UL94 V-0 | Square | 0.51 µm | 20 µin | 78 | 2 | ||
Samtec Inc. | Through Hole | -55 °C | 125 °C | Board to Board Cable | Push-Pull | Elevated Socket | Gold | 0.775 in | 19.69 mm | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Forked | 1.91 mm | Tin | 0.079 in | 2 mm | All | 0.079 in | 2 mm | Black | 4.5 A | Solder | UL94 V-0 | Square | 0.51 µm | 20 µin | 0.075 in | 78 | 2 |