ESQT-139 Series
Manufacturer: Samtec Inc.
CONN SOCKET 156P 0.079 GOLD PCB
| Part | Contact Finish Thickness - Mating | Material Flammability Rating | Style | Number of Rows | Row Spacing - Mating | Current Rating (Per Contact) | Contact Finish - Mating | Contact Type | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions Loaded | Termination | Mounting Type | Pitch - Mating | Connector Type | Number of Positions | Contact Finish - Post | Insulation Color | Contact Length - Post | Fastening Type | Insulation Height | Contact Finish Thickness - Post | Contact Shape | Contact Material | Insulation Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 4 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 156 | Gold | Black | 0.157 in | Push-Pull | 0.693 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 4 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 156 | Gold | Black | 0.211 in | Push-Pull | 0.639 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Gold | Black | 0.315 in | Push-Pull | 0.535 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Gold | Black | 0.285 in | Push-Pull | 0.565 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Gold | Black | 0.075 in | Push-Pull | 0.775 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Tin | Black | 0.157 in | Push-Pull | 0.693 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Gold | Black | 0.148 in | Push-Pull | 0.31 in | 3 µin | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
Samtec Inc. | 20 Ąin | UL94 V-0 | Board Board or Cable | 2 | 0.079 in | 4.5 A | Gold | Forked | 125 °C | -55 °C | All | Solder | Through Hole | 0.079 in | Elevated Socket | 78 | Tin | Black | 0.075 in | Push-Pull | 0.775 in | Square | Phosphor Bronze | Liquid Crystal Polymer (LCP) |