36-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS TIN

Part	Pitch - Mating	Pitch - Mating	Features	Material Flammability Rating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Contact Material - Mating	Termination	Type	Type	Type	Termination Post Length	Termination Post Length	Mounting Type	Contact Finish - Post	Housing Material
Aries Electronics 36-3574-11	0.1 in	2.54 mm	Closed Frame	UL94 V-0	36	2.54 mm	0.1 in	1 A	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper	Beryllium Copper	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-3574-18	0.1 in	2.54 mm	Closed Frame	UL94 V-0	36	2.54 mm	0.1 in	1 A	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper	Beryllium Copper	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-3574-10	0.1 in	2.54 mm	Closed Frame	UL94 V-0	36	2.54 mm	0.1 in	1 A	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper	Beryllium Copper	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled