28-3503 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Housing Material	Features	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Mating	Contact Material - Mating	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Post	Contact Finish - Post	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Current Rating (Amps)
Aries Electronics 28-3503-20	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	105 ░C	-55 °C	Gold	Beryllium Copper	2.54 mm	0.1 in	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Tin	UL94 V-0	0.36 in	9.14 mm	28	200 µin	5.08 µm	0.1 in	2.54 mm	3 A
Aries Electronics 28-3503-21	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	125 °C	-55 °C	Gold	Beryllium Copper	2.54 mm	0.1 in	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Gold	UL94 V-0	0.36 in	9.14 mm	28	10 çin	0.25 çm	0.1 in	2.54 mm	3 A