14-3508 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Contact Material - Mating	Current Rating (Amps)	Contact Finish - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Material Flammability Rating	Features	Contact Material - Post [custom]	Housing Material	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 14-3508-312	Beryllium Copper	3 A	Gold	Gold	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	0.5 in	12.7 mm	Through Hole	-55 °C	125 °C
Aries Electronics 14-3508-21	Beryllium Copper	3 A	Gold	Gold	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	0.5 in	12.7 mm	Through Hole	-55 °C	125 °C
Aries Electronics 14-3508-31	Beryllium Copper	3 A	Gold	Gold	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	0.5 in	12.7 mm	Through Hole	-55 °C	125 °C
Aries Electronics 14-3508-301	Beryllium Copper	3 A	Gold	Tin	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	200 µin	5.08 µm			Through Hole	-55 °C	105 ░C	0.36 in	9.14 mm
Aries Electronics 14-3508-302	Beryllium Copper	3 A	Gold	Tin	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	200 µin	5.08 µm			Through Hole	-55 °C	105 ░C	0.36 in	9.14 mm
Aries Electronics 14-3508-20	Beryllium Copper	3 A	Gold	Tin	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	200 µin	5.08 µm			Through Hole	-55 °C	105 ░C	0.36 in	9.14 mm
Aries Electronics 14-3508-201	Beryllium Copper	3 A	Gold	Tin	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	200 µin	5.08 µm			Through Hole	-55 °C	105 ░C	0.36 in	9.14 mm
Aries Electronics 14-3508-311	Beryllium Copper	3 A	Gold	Gold	2.54 mm	0.1 in	UL94 V-0	Open Frame	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	14	30 Áin	0.76 Ám	Wire Wrap	0.3 "	7.62 mm	DIP	10 çin	0.25 çm	0.5 in	12.7 mm	Through Hole	-55 °C	125 °C