HMTSW-140 Series

Catalog

CONN HEADER VERT 40POS 2.54MM

Part	Number of Positions	Contact Type	Shrouding	Mounting Type	Termination	Contact Length - Mating	Contact Shape	Insulation Material	Style	Current Rating	Material Flammability Rating	Pitch - Mating	Fastening Type	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Insulation Height	Number of Positions Loaded	Connector Type	Overall Contact Length	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Contact Length - Post	Contact Material	Insulation Color	Contact Finish Thickness - Post	Row Spacing - Mating
Samtec Inc. HMTSW-140-07-G-S-240	40	Male Pin	Unshrouded	Through Hole	Solder	0.24 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Gold	10 µin	0.1 in	All	Header	0.43 in	1	125 °C	-55 °C	0.09 in	Phosphor Bronze	Natural	3 µin
Samtec Inc. HMTSW-140-10-G-D-565	80	Male Pin	Unshrouded	Through Hole	Solder	0.565 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Gold	10 µin	0.1 in	All	Header	0.83 in	2	125 °C	-55 °C	0.165 in	Phosphor Bronze	Natural	3 µin	0.1 in
Samtec Inc. HMTSW-140-10-G-D-400	80	Male Pin	Unshrouded	Through Hole	Solder	0.4 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Gold	10 µin	0.1 in	All	Header	0.83 in	2	125 °C	-55 °C	0.33 in	Phosphor Bronze	Natural	3 µin	0.1 in
Samtec Inc. HMTSW-140-08-S-D-240	80	Male Pin	Unshrouded	Through Hole	Solder	0.24 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Tin	30 µin	0.1 in	All	Header	0.53 in	2	125 °C	-55 °C	0.19 in	Phosphor Bronze	Natural		0.1 in
Samtec Inc. HMTSW-140-22-G-D-225	80	Male Pin	Unshrouded	Through Hole	Solder	0.225 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Gold	10 µin	0.1 in	All	Header	0.63 in	2	125 °C	-55 °C	0.305 in	Phosphor Bronze	Natural	3 µin	0.1 in
Samtec Inc. HMTSW-140-09-L-D-480	80	Male Pin	Unshrouded	Through Hole	Solder	0.48 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Tin	10 µin	0.1 in	All	Header	0.73 in	2	125 °C	-55 °C	0.15 in	Phosphor Bronze	Natural		0.1 in
Samtec Inc. HMTSW-140-21-T-S-930-RA	40	Male Pin	Unshrouded	Right Angle Through Hole	Solder	0.93 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Tin	Tin		0.122 in	All	Header		1	105 °C	-55 °C		Phosphor Bronze	Natural
Samtec Inc. HMTSW-140-07-L-D-240	80	Male Pin	Unshrouded	Through Hole	Solder	0.24 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Tin	10 µin	0.1 in	All	Header	0.43 in	2	125 °C	-55 °C	0.09 in	Phosphor Bronze	Natural		0.1 in
Samtec Inc. HMTSW-140-08-F-S-236	40	Male Pin	Unshrouded	Through Hole	Solder	0.236 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Tin	3 µin	0.1 in	All	Header	0.53 in	1	125 °C	-55 °C	0.194 in	Phosphor Bronze	Natural
Samtec Inc. HMTSW-140-13-G-D-013	80	Male Pin	Unshrouded	Through Hole	Solder	0.013 in	Square	Liquid Crystal Polymer (LCP)	Board Board or Cable	3 A	UL94 V-0	0.1 in	Push-Pull	Gold	Gold	10 µin	0.1 in	All	Header	1.23 in	2	125 °C	-55 °C	1.117 in	Phosphor Bronze	Natural	3 µin	0.1 in