ESW-134 Series
Manufacturer: Samtec Inc.
CONN SOCKET 68POS 0.1 GOLD PCB
| Part | Number of Positions | Current Rating (Per Contact) | Pitch - Mating | Contact Finish Thickness - Mating | Connector Type | Contact Length - Post | Contact Finish - Mating | Contact Type | Number of Positions Loaded | Insulation Height | Termination | Operating Temperature (Max) | Operating Temperature (Min) | Fastening Type | Voltage Rating | Mounting Type | Insulation Color | Row Spacing - Mating | Material Flammability Rating | Contact Finish - Post | Number of Rows | Style | Contact Material | Contact Finish Thickness - Post | Insulation Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 68 | 5.2 A | 0.1 in | 20 Ąin | Elevated Socket | 0.18 in | Gold | Forked | All | 0.735 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | 0.1 in | UL94 V-0 | Gold | 2 | Board | Phosphor Bronze | 3 µin | Liquid Crystal Polymer (LCP) | Square |
Samtec Inc. | 68 | 5.2 A | 0.1 in | 20 Ąin | Elevated Socket | 0.28 in | Gold | Forked | All | 0.635 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | 0.1 in | UL94 V-0 | Gold | 2 | Board | Phosphor Bronze | 3 µin | Liquid Crystal Polymer (LCP) | Square |
Samtec Inc. | 68 | 5.2 A | 0.1 in | 10 µin | Elevated Socket | 0.18 in | Gold | Forked | All | 0.735 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | 0.1 in | UL94 V-0 | Tin | 2 | Board | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | 34 | 5.2 A | 0.1 in | 30 µin | Elevated Socket | 0.09 in | Gold | Forked | All | 0.435 in | Kinked Pin Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | UL94 V-0 | Tin | 1 | Board | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | 68 | 5.2 A | 0.1 in | 30 µin | Elevated Socket | 0.09 in | Gold | Forked | All | 0.435 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | 0.1 in | UL94 V-0 | Tin | 2 | Board | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | 34 | 5.2 A | 0.1 in | 20 Ąin | Elevated Socket | 0.18 in | Gold | Forked | All | 0.735 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | UL94 V-0 | Gold | 1 | Board | Phosphor Bronze | 3 µin | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | 34 | 5.2 A | 0.1 in | Elevated Socket | 0.09 in | Tin | Forked | All | 0.435 in | Solder | 105 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | UL94 V-0 | Tin | 1 | Board | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |||
Samtec Inc. | 68 | 5.2 A | 0.1 in | 10 µin | Elevated Socket | 0.18 in | Gold | Forked | All | 0.735 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | 0.1 in | UL94 V-0 | Tin | 2 | Board | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | 34 | 5.2 A | 0.1 in | 20 Ąin | Elevated Socket | 0.48 in | Gold | Forked | All | 0.435 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | UL94 V-0 | Gold | 1 | Board | Phosphor Bronze | 3 µin | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | 34 | 5.2 A | 0.1 in | 20 Ąin | Elevated Socket | 0.19 in | Gold | Forked | All | 0.535 in | Solder | 125 °C | -55 °C | Push-Pull | 550 V | Through Hole | Black | UL94 V-0 | Gold | 1 | Board | Phosphor Bronze | 3 µin | Liquid Crystal Polymer (LCP) | Square |