CONN SOCKET PGA ZIF GOLD
| Part | Contact Material - Mating | Type | Pitch - Post | Pitch - Post | Termination | Material Flammability Rating | Features | Mounting Type | Current Rating (Amps) | Contact Finish - Post | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | PGA ZIF (ZIP) | 2.54 mm | 0.1 in | Solder | UL94 V-0 | Closed Frame | Through Hole | 1 A | Tin | Gold | 125 °C | -65 ░C | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | 200 µin | 5.08 µm | Beryllium Copper | 30 Áin | 0.76 Ám |
Aries Electronics | Beryllium Copper | PGA ZIF (ZIP) | 2.54 mm | 0.1 in | Solder | UL94 V-0 | Closed Frame | Through Hole | 1 A | Tin | Gold | 125 °C | -65 ░C | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | 200 µin | 5.08 µm | Beryllium Copper | 30 Áin | 0.76 Ám |