40-6570 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Termination Post Length	Termination Post Length	Features	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Post	Contact Finish - Post	Pitch - Post	Pitch - Post	Mounting Type
Aries Electronics 40-6570-11	1 A	10 çin	0.25 çm	Beryllium Copper	Solder	40	20	2	UL94 V-0	Gold	10 çin	0.25 çm	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	2.54 mm	0.1 in	Through Hole
Aries Electronics 40-6570-16	1 A	50 µin	1.27 µm	Beryllium Nickel	Solder	40	20	2	UL94 V-0	Nickel Boron	50 µin	1.27 µm	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel	Nickel Boron	2.54 mm	0.1 in	Through Hole
Aries Electronics 40-6570-10	1 A	200 µin	5.08 µm	Beryllium Copper	Solder	40	20	2	UL94 V-0		200 µin	5.08 µm	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Tin	2.54 mm	0.1 in	Through Hole