SLG46811 Series
Manufacturer: Renesas Electronics Corporation
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PROTOTYPE BOARD, DIP-20, GREENPAK SLG46811 SERIES, PROGRAMMABLE MIXED-SIGNAL MATRIX
| Part | For Use With/Related Products | Suggested Programming Environment | Utilized IC / Part | Contents | Type | Platform | Module/Board Type | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Voltage Supply - Internal (Maximum) | Voltage Supply - Internal (Minimum) | Number of Macrocells | Number of I/O | Package Name | Package Length | Package Width | Programmable Type | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Renesas Electronics Corporation | SLG46811 | GreenPAK Designer | SLG46811 | Board | CMIC (Configurable Mixed-Signal Integrated Circuit) | GreenPAK Programmable Mixed-Signal Matrix | |||||||||||||
 Renesas Electronics Corporation | SLG46811 | SLG46811 | QFN Socket Module | ||||||||||||||||
 Renesas Electronics Corporation | Surface Mount | 85 °C | -40 °C | 5.5 V | 2.3 V | 18 | 9 | 12-STQFN | 1.6 mm | 1.6 mm | OTP | 12-UFQFN |