CONN RCPT 11POS 0.05 GOLD PCB
| Part | Contact Material | Connector Type | Insulation Color | Insulation Height | Insulation Height | Number of Rows | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Type | Contact Finish - Post | Contact Shape | Number of Positions | Contact Length - Post | Contact Length - Post | Number of Positions Loaded | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Row Spacing - Mating [x] | Row Spacing - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | Receptacle | Black | 4.57 mm | 0.18 " | 1 | Through Hole | 0.05 in | 1.27 mm | Gold | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Push-Pull | 30 Áin | 0.76 Ám | Solder | Forked | Tin | Rectangular | 11 | 2.92 mm | 0.115 in | All | ||||
Samtec Inc. | Phosphor Bronze | Receptacle | Black | 4.57 mm | 0.18 " | 2 | Through Hole | 0.05 in | 1.27 mm | Gold | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Push-Pull | 20 µin | 0.51 µm | Solder | Forked | Gold | Rectangular | 22 positions | 2.92 mm | 0.115 in | All | 3 µin | 0.076 µm | 2.54 mm | 0.1 in |
Samtec Inc. | Phosphor Bronze | Receptacle | Black | 4.57 mm | 0.18 " | 1 | Through Hole | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | -55 °C | 105 ░C | Push-Pull | Solder | Forked | Tin | Rectangular | 11 | 2.92 mm | 0.115 in | All | |||||||
Samtec Inc. | Phosphor Bronze | Receptacle | Black | 4.57 mm | 0.18 " | 2 | Through Hole | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | -55 °C | 105 ░C | Push-Pull | Solder | Forked | Tin | Rectangular | 22 positions | 2.92 mm | 0.115 in | All | 2.54 mm | 0.1 in |