628-65 Series

Catalog

HEATSINK FOR 45MM BGA

Part	Material	Shape	Width [x]	Width [x]	Material Finish	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Type	Attachment Method	Length	Length	Fin Height [z]	Fin Height [z]	Package Cooled
Wakefield-Vette 628-65ABT1E	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65ABT5	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65ABT4E	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65AB	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Not Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA