40-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Features	Contact Finish - Post	Housing Material	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Type	Type	Type	Material Flammability Rating	Contact Finish - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Mounting Type
Aries Electronics 40-3553-18	-55 °C	250 °C	Solder	1.27 µm	50 µin	Beryllium Nickel	Closed Frame	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	40	20	2	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	Nickel Boron	0.11 in	2.78 mm	1.27 µm	50 µin	Beryllium Nickel	2.54 mm	0.1 in	0.1 in	2.54 mm	Through Hole
Aries Electronics 40-3553-10			Solder	5.08 µm	200 µin	Beryllium Copper	Closed Frame	Tin	Polyphenylene Sulfide (PPS) Glass Filled	40	20	2	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0		0.11 in	2.78 mm	5.08 µm	200 µin	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Through Hole
Aries Electronics 40-3553-16			Solder	1.27 µm	50 µin	Beryllium Copper	Closed Frame	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	40	20	2	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	Nickel Boron	0.11 in	2.78 mm	1.27 µm	50 µin	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Through Hole
Aries Electronics 40-3553-11			Solder			Beryllium Copper	Closed Frame	Gold	Polyphenylene Sulfide (PPS) Glass Filled	40	20	2	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	Gold	0.11 in	2.78 mm			Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Through Hole