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CONN IC DIP SOCKET ZIF 40POS
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Termination | Contact Material - Mating | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post | Current Rating (Amps) | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | 1.27 µm | 50 µin | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Nickel Boron | 1.27 µm | 50 µin | Closed Frame | Solder | Beryllium Nickel | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | 0.1 in | 2.54 mm | 40 | 20 | 2 | Beryllium Nickel | 1 A | 0.11 in | 2.78 mm |
Aries Electronics | Through Hole | 0.25 çm | 10 çin | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 0.25 çm | 10 çin | Closed Frame | Solder | Beryllium Copper | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | 0.1 in | 2.54 mm | 40 | 20 | 2 | Beryllium Copper | 1 A | 0.11 in | 2.78 mm |