A1P50S65M2 Series
ACEPACK 1 sixpack topology, 650 V, 50 A trench gate field-stop IGBT M series, soft diode and NTC
Manufacturer: STMicroelectronics
Catalog
ACEPACK 1 sixpack topology, 650 V, 50 A trench gate field-stop IGBT M series, soft diode and NTC
Key Features
• ACEPACK™ 1 power module
- DBC Cu Al2O3Cu
• Sixpack topology
- 650 V, 50 A IGBTs and diodes
- Soft and fast recovery diode
Description
AI
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.