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CONN IC DIP SOCKET 14POS TIN
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Finish - Post | Material Flammability Rating | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Current Rating (Amps) | Contact Material - Post | Termination | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Mounting Type | Type | Type | Type | Contact Finish - Mating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 5.08 µm | 200 µin | 14 | Tin | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | 2.54 mm | 0.1 in | 1 A | Phosphor Bronze | Solder | 0.1 in | 2.54 mm | Closed Frame Elevated | 200 µin | 5.08 µm | Phosphor Bronze | 3.56 mm | 0.14 in | Through Hole | 0.3 " | 7.62 mm | DIP | ||
Aries Electronics | 0.76 Ám | 30 Áin | 14 | Gold | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | 2.54 mm | 0.1 in | 3 A | Solder | 0.1 in | 2.54 mm | Closed Frame Elevated | 10 çin | 0.25 çm | Beryllium Copper | 3.56 mm | 0.14 in | Through Hole | 0.3 " | 7.62 mm | DIP | Gold | Brass |