CONN HEADER SMD R/A 170P 0.8MM
| Part | Termination | Number of Rows | Insulation Material | Shrouding | Row Spacing - Mating | Row Spacing - Mating | Contact Finish - Mating | Number of Positions | Pitch - Mating | Pitch - Mating | Insulation Color | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Contact Finish - Post | Number of Positions Loaded | Insulation Height | Insulation Height | Material Flammability Rating | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating [x] | Contact Length - Mating [x] | Contact Material | Fastening Type | Mounting Type | Connector Type | Contact Type | Features | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | 2 | Liquid Crystal Polymer (LCP) | Unshrouded | 1.2 mm | 0.047 in | Gold | 170 | 0.031 in | 0.8 mm | Black | -55 °C | 125 °C | 2.7 A | Gold | All | 3.05 mm | 0.12 in | UL94 V-0 | Square | 10 çin | 0.25 çm | 3 µin | 0.076 µm | 1.9 mm | 0.075 in | Phosphor Bronze | Push-Pull | Surface Mount Right Angle | Header | Male Pin | |||
Samtec Inc. | Solder | 2 | Liquid Crystal Polymer (LCP) | Unshrouded | 1.2 mm | 0.047 in | Gold | 170 | 0.031 in | 0.8 mm | Black | -55 °C | 125 °C | 2.7 A | Gold | All | UL94 V-0 | Square | 10 çin | 0.25 çm | 1.9 mm | 0.075 in | Phosphor Bronze | Push-Pull | Surface Mount | Header | Male Pin | Board Guide End Shrouds | 0.055 in | 1.4 mm | ||||
Samtec Inc. | Solder | 2 | Liquid Crystal Polymer (LCP) | Unshrouded | 1.2 mm | 0.047 in | Gold | 170 | 0.031 in | 0.8 mm | Black | -55 °C | 125 °C | 2.7 A | Gold | All | UL94 V-0 | Square | 10 çin | 0.25 çm | 3 µin | 0.076 µm | 1.9 mm | 0.075 in | Phosphor Bronze | Push-Pull | Surface Mount | Header | Male Pin | 0.055 in | 1.4 mm |