Beta
⌘K
CONN IC DIP SOCKET 28POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Contact Material - Post [custom] | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Current Rating (Amps) | Type | Type | Type | Mounting Type | Termination | Contact Material - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Features | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | Gold | 3.56 mm | 0.14 in | Gold | 3 A | DIP | 0.6 in | 15.24 mm | Through Hole | Solder | Beryllium Copper | UL94 V-0 | 2.54 mm | 0.1 in | 105 ░C | -55 °C | Closed Frame Elevated | 28 |